EPS Reference Time Actual Consensus Previous
2026-05-06 FY2026Q2 PM 0.35 -0.25
2026-02-04 FY2026Q1 PM 0.44 0.33 0.37
2025-11-19 FY2025Q3 PM 0.28 0.22 0.34
2025-08-06 FY2025Q3 PM 0.07 0.35 0.35
2025-05-06 FY2025Q2 PM -0.25 0.30 -0.95



Peers Price Chg Day Year Date
Axcelis Technologies 97.26 2.17 2.28% 116.86% Apr/06
Advanced Energy Industries 334.93 2.62 0.79% 308.80% Apr/06
Applied Materials 350.91 2.44 0.70% 164.14% Apr/06
Amkor Technology 47.05 0.35 0.75% 206.12% Apr/06
Azenta 22.84 0.21 0.93% -21.51% Apr/06
Cohu 32.63 0.49 1.52% 134.41% Apr/06
Daqo New Energy 21.11 -0.28 -1.31% 27.02% Apr/02
Enphase Energy 33.37 -1.55 -4.44% -40.15% Apr/06
Entegris 115.17 -1.23 -1.06% 72.31% Apr/06
FormFactor 104.15 0.99 0.96% 327.37% Apr/06

Indexes Price Day Year Date
USND 21983 103.95 0.48% 40.89% Apr/06

Kulicke And Soffa Industries traded at $64.08 this Thursday April 2nd, decreasing $2.20 or 3.32 percent since the previous trading session. Looking back, over the last four weeks, Kulicke And Soffa Industries lost 3.23 percent. Over the last 12 months, its price rose by 116.85 percent. Looking ahead, we forecast Kulicke And Soffa Industries to be priced at 62.54 by the end of this quarter and at 58.12 in one year, according to Trading Economics global macro models projections and analysts expectations.

Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (ICs), high and low powered discrete devices, light-emitting diodes (LEDs) and power modules. The Company also services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. It operates through two segments: Capital Equipment and Aftermarket Products and Services (APS). The Capital Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The APS segment manufactures and sells expendable tools for a range of semiconductor packaging applications. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers.