Stock Price
98.16
Daily Change
-9.36 -8.71%
Monthly
4.67%
Yearly
195.93%
Q2 Forecast
96.54

EPS Reference Time Actual Consensus Previous
2026-05-06 FY2026Q2 PM 0.79 0.35 -0.25
2026-02-04 FY2026Q1 PM 0.44 0.33 0.37
2025-11-19 FY2025Q3 PM 0.28 0.22 0.34
2025-08-06 FY2025Q3 PM 0.07 0.35 0.35
2025-05-06 FY2025Q2 PM -0.25 0.30 -0.95



Peers Price Chg Day Year Date
Axcelis Technologies 147.16 -14.71 -9.09% 131.71% Jun/05
Advanced Energy Industries 294.81 -26.11 -8.14% 142.52% Jun/05
Applied Materials 453.01 -48.69 -9.71% 171.69% Jun/05
Amkor Technology 64.95 -8.87 -12.02% 237.23% Jun/05
Azenta 22.69 -0.15 -0.66% -21.08% Jun/05
Cohu 49.81 -6.07 -10.86% 172.78% Jun/05
Daqo New Energy 16.80 0.42 2.56% 25.75% Jun/02
Enphase Energy 56.07 -12.32 -18.01% 36.16% Jun/05
Entegris 125.41 -14.47 -10.34% 71.98% Jun/05
FormFactor 116.70 -9.91 -7.82% 262.76% Jun/05

Indexes Price Day Year Date
USND 25709 -1,121.53 -4.18% 31.64% Jun/05

Kulicke And Soffa Industries traded at $98.16 this Friday June 5th, decreasing $9.36 or 8.71 percent since the previous trading session. Looking back, over the last four weeks, Kulicke And Soffa Industries lost 4.67 percent. Over the last 12 months, its price rose by 195.93 percent. Looking ahead, we forecast Kulicke And Soffa Industries to be priced at 96.54 by the end of this quarter and at 91.84 in one year, according to Trading Economics global macro models projections and analysts expectations.

Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (ICs), high and low powered discrete devices, light-emitting diodes (LEDs) and power modules. The Company also services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. It operates through two segments: Capital Equipment and Aftermarket Products and Services (APS). The Capital Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The APS segment manufactures and sells expendable tools for a range of semiconductor packaging applications. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers.