EPS Reference Time Actual Consensus Previous
2026-11-18 FY2026Q3 PM 0.78 0.28
2026-08-05 FY2026Q3 PM 1.20 0.74 0.07
2026-05-06 FY2026Q2 PM 0.79 0.35 -0.25
2026-02-04 FY2026Q1 PM 0.44 0.33 0.37
2025-11-19 FY2025Q3 PM 0.28 0.22 0.34



Peers Price Chg Day Year Date
Axcelis Technologies 109.11 2.53 2.37% 31.06% Oct/26
Advanced Energy Industries 221.13 4.50 2.08% 7.81% Oct/26
Applied Materials 387.59 10.35 2.74% 67.55% Oct/26
Amkor Technology 36.81 -2.49 -6.34% 10.94% Oct/26
Azenta 37.17 0.67 1.84% 16.59% Oct/26
Cohu 48.85 0.89 1.86% 107.78% Oct/26
Daqo New Energy 10.20 0.12 1.19% -61.08% Oct/23
Enphase Energy 30.36 -1.24 -3.92% -17.52% Oct/26
Entegris 140.22 5.70 4.24% 48.66% Oct/26
FormFactor 101.11 2.60 2.64% 131.00% Oct/26

Indexes Price Day Year Date
USND 26169 214.04 0.82% 10.71% Oct/26

Kulicke And Soffa Industries traded at $73.71 this Friday October 23rd, increasing $0.31 or 0.42 percent since the previous trading session. Looking back, over the last four weeks, Kulicke And Soffa Industries gained 16.68 percent. Over the last 12 months, its price rose by 80.62 percent. Looking ahead, we forecast Kulicke And Soffa Industries to be priced at 72.28 by the end of this quarter and at 68.15 in one year, according to Trading Economics global macro models projections and analysts expectations.

Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (ICs), high and low powered discrete devices, light-emitting diodes (LEDs) and power modules. The Company also services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. It operates through two segments: Capital Equipment and Aftermarket Products and Services (APS). The Capital Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The APS segment manufactures and sells expendable tools for a range of semiconductor packaging applications. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers.