Stock Price
56.02
Daily Change
3.12 5.90%
Monthly
19.34%
Yearly
90.67%
Q4 Forecast
54.80

EPS Reference Time Actual Consensus Previous
2026-11-02 FY2026Q3 PM 0.63 0.51
2026-07-27 FY2026Q2 PM 0.70 0.47 0.22
2026-04-27 FY2026Q1 PM 0.33 0.22 0.09
2026-02-09 FY2025Q4 PM 0.69 0.44 0.43
2025-10-27 FY2025Q3 PM 0.51 0.43 0.49



Peers Price Chg Day Year Date
Taiwan Semiconductor 2,575.00 75.00 3.00% 79.44% Oct/05
Axcelis Technologies 147.77 11.06 8.09% 66.58% Oct/02
Advanced Energy Industries 304.28 10.17 3.46% 75.01% Oct/02
Applied Materials 536.16 -3.88 -0.72% 146.48% Oct/05
Amkor Technology 56.02 3.12 5.90% 90.67% Oct/02
Advanced Semiconductor Engineering 47.45 2.72 6.08% 328.25% Oct/02
Azenta 40.51 1.76 4.54% 24.84% Oct/05
Cohu 72.10 -1.38 -1.88% 257.28% Oct/05
Daqo New Energy 11.00 -0.15 -1.35% -60.90% Oct/02
Enphase Energy 32.92 -0.55 -1.64% -11.41% Oct/05

Indexes Price Day Year Date
USND 27392 201.59 0.74% 19.40% Oct/05
US2000 2836 2.99 0.11% 14.06% Oct/05

Amkor Technology traded at $56.02 this Friday October 2nd, increasing $3.12 or 5.90 percent since the previous trading session. Looking back, over the last four weeks, Amkor Technology gained 19.34 percent. Over the last 12 months, its price rose by 90.67 percent. Looking ahead, we forecast Amkor Technology to be priced at 54.80 by the end of this quarter and at 51.31 in one year, according to Trading Economics global macro models projections and analysts expectations.

Amkor Technology, Inc. is a providers of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The semiconductor manufacturing process consists of Integrated circuit (IC) design, wafer fabrication, wafer probe, packaging and final test. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. IDMs generally design, manufacture, package and test semiconductors in their own facilities.