Stock Price
47.12
Daily Change
-4.61 -8.91%
Monthly
-23.13%
Yearly
83.49%
Q3 Forecast
50.62

EPS Reference Time Actual Consensus Previous
2026-11-02 FY2026Q3 PM 0.63 0.51
2026-07-27 FY2026Q2 PM 0.70 0.47 0.22
2026-04-27 FY2026Q1 PM 0.33 0.22 0.09
2026-02-09 FY2025Q4 PM 0.69 0.44 0.43
2025-10-27 FY2025Q3 PM 0.51 0.43 0.49



Peers Price Chg Day Year Date
Taiwan Semiconductor 2,380.00 -30.00 -1.24% 89.64% Sep/14
Axcelis Technologies 105.31 -8.12 -7.16% 20.63% Sep/14
Advanced Energy Industries 254.35 -32.90 -11.45% 62.28% Sep/14
Applied Materials 424.21 -32.28 -7.07% 148.18% Sep/14
Amkor Technology 47.12 -4.61 -8.91% 83.49% Sep/14
Advanced Semiconductor Engineering 39.47 -0.39 -0.98% 252.73% Sep/11
Azenta 32.04 1.19 3.86% 7.01% Sep/14
Cohu 49.97 -7.11 -12.46% 136.15% Sep/14
Daqo New Energy 11.54 -0.17 -1.45% -58.40% Sep/11
Enphase Energy 36.66 0.31 0.85% -3.48% Sep/14

Indexes Price Day Year Date
USND 26186 -146.62 -0.56% 17.17% Sep/14
US2000 2892 -11.86 -0.41% 20.25% Sep/14

Amkor Technology traded at $47.12 this Monday September 14th, decreasing $4.61 or 8.91 percent since the previous trading session. Looking back, over the last four weeks, Amkor Technology lost 23.13 percent. Over the last 12 months, its price rose by 83.49 percent. Looking ahead, we forecast Amkor Technology to be priced at 50.62 by the end of this quarter and at 47.44 in one year, according to Trading Economics global macro models projections and analysts expectations.

Amkor Technology, Inc. is a providers of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The semiconductor manufacturing process consists of Integrated circuit (IC) design, wafer fabrication, wafer probe, packaging and final test. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. IDMs generally design, manufacture, package and test semiconductors in their own facilities.