Amkor Technology traded at $21.97 this Thursday August 11th, increasing $0.23 or 1.04 percent since the previous trading session. Looking back, over the last four weeks, Amkor Technology gained 34.26 percent. Over the last 12 months, its price fell by 16.00 percent. Looking ahead, we forecast Amkor Technology to be priced at 22.02 by the end of this quarter and at 20.24 in one year, according to Trading Economics global macro models projections and analysts expectations.

Stock Price
21.97
Daily Change
1.04%
Yearly
-16.00%

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Peers Price Day Year
Samsung 59,900.00 800.00 1.35% -21.49%
Taiwan Semiconductor 514.00 14.00 2.80% -12.29%
Axcelis Technologies 70.62 -0.11 -0.16% 61.64%
Advanced Energy Industries 94.18 0.09 0.10% 8.53%
Applied Materials 105.50 0.48 0.46% -18.36%
Amkor Technology 21.97 0.23 1.04% -16.00%
Advanced Semiconductor Engineering 6.20 0.01 0.16% -31.94%
Azenta INC 61.71 -0.19 -0.31% -25.53%
Cohu 28.99 0.10 0.35% -4.98%
Daqo New Energy 70.73 0.02 0.03% 24.94%
Enphase Energy 293.39 -9.86 -3.25% 61.83%
Entegris 102.08 -1.22 -1.18% -9.99%
FormFactor 34.20 -0.07 -0.20% -2.84%
Intel 35.59 0.22 0.62% -33.53%
KLA-Tencor 372.75 -1.76 -0.47% 13.47%
Kulicke And Soffa Industries 48.83 1.02 2.13% -23.91%
Lam Research 497.46 2.51 0.51% -14.75%
MKS Instruments 116.51 0.50 0.43% -20.67%
Onto Innovation Inc. 80.28 1.10 1.39% 10.34%
Universal Display 121.82 -1.67 -1.35% -39.07%
PDF Solutions 27.38 0.17 0.62% 27.41%
Photronics 23.71 -0.13 -0.55% 78.54%
Rubicon Technology 16.13 0.10 0.59% 73.20%
Rambus 26.25 0.21 0.81% 9.38%
Taiwan Semiconductor Mfg 89.52 0.85 0.96% -22.63%
Texas Instruments 182.06 -1.06 -0.58% -3.09%
Ultra Clean 32.90 0.50 1.54% -24.30%
Veeco Instruments 22.24 0.39 1.78% 2.35%

Indexes Price Day Year
USND 12780 -74.89 -0.58% -13.74%
US2000 1975 6.01 0.31% -11.98%

Amkor Technology
Amkor Technology, Inc. is a providers of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The semiconductor manufacturing process consists of Integrated circuit (IC) design, wafer fabrication, wafer probe, packaging and final test. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. IDMs generally design, manufacture, package and test semiconductors in their own facilities.