Hewlett Packard reported $18.24B in Loan Capital for its fiscal quarter ending in March of 2026.





Loan Capital Change Date
3D Systems USD 87.24M 454K Jun/2026
Advanced Micro Devices USD 2.35B 1000K Jun/2026
Amazon USD 128.89B 9.82B Jun/2026
Amphenol USD 17.18B 537.7M Jun/2026
Apple USD 71.34B 3.06B Jun/2026
AT & S Austria Technologie & Systemtechnik AG EUR 1.26B 346.24M Mar/2026
Barco NV EUR 41.06M 3.8M Jun/2025
Broadcom USD 62.66B 1.15B Mar/2026
CDW USD 4.81B 173M Jun/2026
Ciena USD 1.52B 5.2M Mar/2026
Cisco Systems USD 19.37B 2B Mar/2026
Codan AUD 143.25M 9.95M Dec/2025
Cognizant Technology Solutions USD 1.53B 992M Jun/2026
CommScope USD 7.26B 1.98B Dec/2025
Corning USD 7.76B 38M Jun/2026
Cx Technology TWD 608.33M 30.3M Mar/2026
Datatec USD 77.56M 12.17M Jun/2026
Dell Technologies USD 23.61B 98M Mar/2026
Dicker Data AUD 271.09M 48.13M Dec/2025
Extreme Networks USD 144.38M 4.84M Jun/2026
F5 Networks USD 0 0 Dec/2024
Fujitsu JPY 91.47B 1.18B Jun/2026
Gold Circuit Elect TWD 9.27B 2.67B Mar/2026
Hewlett Packard USD 18.24B 532M Mar/2026
Hitachi JPY 562.94B 23.18B Jun/2026
HP USD 8.86B 18M Mar/2026
IBM USD 56.21B 1.49B Jun/2026
Intel USD 48.55B 5.52B Jun/2026
Jabil Circuit USD 2.88B 497M Mar/2026
Keysight Technologies USD 1.83B 702M Mar/2026
Lenovo USD 3.86B 566.95M Mar/2026
Logitech International USD 0 0 Dec/2024
Micron Technology USD 3.05B 6.51B Mar/2026
Motorola Solutions Msi USD 8.42B 2M Jun/2026
NetApp USD 2.49B 1000K Mar/2026
Nvidia USD 7.47B 1000K Mar/2026
Oracle USD 122.34B 8.09B Mar/2026
Positivo Tecnologia BRL 787.06M 44.12M Mar/2026
Prime Electronics TWD 59.61M 13.89M Mar/2026
Qualcomm USD 12.78B 1.99B Jun/2026
Samsung Electronics KRW 3.61T 21.63T Mar/2026
Scientech TWD 68.39M 2.22M Mar/2026
Seagate Technology USD 3.38B 85M Jun/2026
Sensata Technologies USD 2.42B 404.6M Jun/2026
Super Micro Computer USD 4.68B 972K Dec/2025
SYNNEX USD 3.59B 1.16M Mar/2026
TE Connectivity USD 5.53B 23M Jun/2026
Western Digital USD 2.43B 28M Dec/2025
Xerox USD 3.48B 785M Jun/2025
Xiaomi CNY 25.01B 2.09B Mar/2026