Stock Price
830.20
Daily Change
9.60 1.17%
Monthly
-7.53%
Yearly
95.57%
Q3 Forecast
812.18

EPS Reference Time Actual Consensus Previous
2026-10-27 FY2026Q3 5.52 7.82
2026-07-28 FY2026Q2 5.96 5.06 3.50
2026-04-21 FY2026Q1 5.01 3.66 3.91
2026-03-03 FY2025Q4 3.45 2.82 4.69
2025-10-28 FY2025Q3 7.82 3.8 2.71



Peers Price Chg Day Year Date
Adyen 928.70 9.70 1.06% -30.96% Sep/11
ASML Holding 1,478.40 4.20 0.28% 114.32% Sep/11
Ericsson 98.66 1.42 1.46% 32.82% Sep/11
Infineon 58.56 2.76 4.95% 84.41% Sep/11
Nokia 9.56 0.32 3.44% 149.62% Sep/11
NXP Semiconductors 236.62 10.16 4.48% 7.91% Sep/12
Philips 21.14 -0.16 -0.75% -12.06% Sep/11
STMicroelectronics 44.43 0.89 2.04% 100.09% Sep/11
STMicroelectronics 44.67 1.04 2.38% 101.31% Sep/11
WorldLine 13.43 -0.52 -3.70% -87.52% Sep/11

Indexes Price Day Year Date
NL30 1099 5.49 0.50% 20.89% Sep/11

ASM International NV traded at 830.20 this Friday September 11th, increasing 9.60 or 1.17 percent since the previous trading session. Looking back, over the last four weeks, ASM International NV gained 7.53 percent. Over the last 12 months, its price rose by 95.57 percent. Looking ahead, we forecast ASM International NV to be priced at 812.18 by the end of this quarter and at 760.45 in one year, according to Trading Economics global macro models projections and analysts expectations.

ASM International N.V. is a supplier of wafer processing equipment, primarily for semiconductor manufacturing industry. The Company designs, manufactures and sells equipment and services to its customers for the production of semiconductor devices, or integrated circuits (ICs). The Company operates in two segments, which include Front-end and Back-end. The Front-end segment manufactures and sells equipment used in wafer processing, encompassing the fabrication steps in which silicon wafers are layered with semiconductor devices. The front-end segment includes manufacturing, service, and sales operations in Europe, the United States, Japan and South East Asia. The Back-end segment manufactures and sells equipment and materials used in assembly and packaging, encompassing the processes in which silicon wafers are separated into individual circuits. The Company supplies equipment to the manufacturers of analog semiconductor devices primarily for the deposition of thin films.