Taiwan Semiconductor | 2330 - Loan Capital



Taiwan Semiconductor reported TWD848.54B in Loan Capital for its fiscal quarter ending in June of 2025.


Loan Capital Change Date
Advanced Micro Devices USD 3.22B 1000K Jun/2025
Applied Materials USD 5.46B 1000K Jul/2025
ASML Holding 3.7B 17.9M Jun/2025
Catcher Technology TWD 533.86M 414.67M Mar/2025
Hou Hai Precision TWD 314.85B 11.65B Jun/2025
Intel USD 44.03B 885M Jun/2025
Jentech Precision TWD 35.88M 5.35M Mar/2025
Lam Research USD 3.73B 160K Jun/2025
Largan Precision TWD 54.17M 14.15M Mar/2025
Lenovo USD 4.66B 55.81M Jun/2025
Mediatek TWD 8.54B 160.9M Mar/2025
Micron Technology USD 15B 1.15B May/2025
Nvidia USD 8.47B 2M Jul/2025
Qualcomm USD 14.79B 1.53B Jun/2025
Seagate Technology USD 5B 151M Jun/2025
Semiconductor Manufacturing International USD 7.97B 75.23M Mar/2025
Shenzhen Goodix Technology CNY 247.05M 4.87M Jun/2025
Silicon Motion Technology USD 0 0 Mar/2025
Taiwan Semiconductor TWD 848.54B 99.72B Jun/2025
Taiwan Semiconductor Mfg TWD 915.04B 71.95B Jun/2025
Tsec TWD 2.02B 118M Mar/2025
Western Digital USD 2.49B 2.42B Jun/2025