Methode Electronics | MEI - Loan Capital


Methode Electronics reported $295.8M in Loan Capital for its fiscal quarter ending in July of 2024.





Loan Capital Change Date
Aac Technologies CNY 7.6B 2.22B Dec/2024
Amphenol USD 16.64B 2.07B Mar/2026
Applied Optoelectronics USD 129.83M 291K Dec/2025
Bel Fuse USD 204.5M 7M Mar/2026
Benchmark Electronics USD 206.83M 5.8M Dec/2025
Cognex USD 0 0 Mar/2025
CTS USD 62.5M 5M Mar/2026
Daktronics USD 74.47M 21.31M Jul/2024
Dolby Laboratories USD 0 0 Mar/2025
Enerpac Tool Group USD 177.25M 2.46M Dec/2025
Fingerprint Cards SEK 900K 900K Jun/2025
IPG Photonics USD 15.73M 297K Mar/2022
Jabil Circuit USD 3.38B 989M Dec/2025
Knowles USD 131M 17M Mar/2026
Littelfuse USD 531.05M 175.34M Mar/2026
Methode Electronics USD 295.8M 35.3M Jul/2024
Osi Systems USD 998.75M 154K Mar/2026
Plexus USD 91.03M 105K Mar/2026
Sanmina USD 2B 1.16M Mar/2026
TE Connectivity USD 5.55B 697M Mar/2026
TTM Technologies USD 911.84M 494K Mar/2026